Smart Systems Integration, Munich: International Conference and Exhibition on Integration Issues of Miniaturized Systems

Responsible speakers from science and industry presented at the anniversary event of the Smart Systems Integration 2016 in Munich numerous innovations, applications and trends of smart systems up to their components. The presented lectures are user- and industry-oriented and demonstrate the potential of innovative smart systems. The international participants could inform themselves and extend their knowledge in 50 lectures 

Main conference topics 2016

·         System integration and packaging

·         Test and reliability

·         Smart medtech systems

·         Hardware for the Internet of Things

·         Printed / stretchable and flexible electronics 

Highlights were the keynotes at the beginning of both days of the conference. Khalil Rouhana from the European Commission talked about „SSI in Europe’s digital industrial strategy!“ and Prof. Dr. Klaus-Dieter Lang, Fraunhofer Institute for Reliability and Microintegration, gave a lecture on “Next Generation of Smart Systems - Essential Precondition for the Internet of Things“.

Two special sessions by EPoSS on the topics „Strategies and opportunities for smart systems research in Horizon2020” as well as “Smart Systems Integration in the JTI ECSEL” completed the program. 

Social program – time for networking and innovations 

A pre-field trip a day before the conference was going to the Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT in Munich. Participants  took an impressive guided tour through selected stations of the institute with short presentations, several exhibits and networking opportunities.

The exhibition showcases the sector

At the accompanying exhibition well-known companies presented their products and solutions. Among them were research institutes, component and system manufacturers as well as service providers in the micro and nano technology, micro optic, sensors, wireless communications, system integration, microelectronic and micromechanics sectors.

The conference with accompanying exhibition took place from 9 – 10 March 2016 in the hotel Holiday Inn Munich.

Daiva I. Petrosiene

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